Product Overview
NAND memory package substrate manufacture is listed by the original manufacturer in the Memory Substrate range. Published specifications include type of IC Substrate, surface finished of Gold Plating, material of BT. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Type: IC Substrate
- Surface Finished: Gold Plating
- Material: BT
- Layers: 4
- Mechanical Rigid: Rigid
Technical Specifications
| Type | IC Substrate |
|---|---|
| Surface Finished | Gold Plating |
| Material | BT |
| Layers | 4 |
| Mechanical Rigid | Rigid |
| Processing Technic | TENTING |
| Transport Package | Carton |
| Highlight | Horexs SD Card PCB , Secure Digital Memory Card PCB , Horexs PCB Flex Board |
Typical Applications
No separate application list was stated on the original product page.
Customization and Supply
Customization requirements should be confirmed from the customer’s drawings and requested configuration.
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
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