About Us
Advanced Manufacturing
High-Precision Production
Advanced manufacturing facilities with automated production lines support high-density IC substrate and ultra-thin PCB manufacturing.
Engineering Support
OEM / ODM Solutions
Professional engineering teams provide technical support from design validation, process optimization to mass production.
Quality System
Reliable Quality Control
Strict quality management covers material inspection, process monitoring, reliability testing, and final product verification.
Technology Innovation
Continuous R&D Development
Continuous investment in semiconductor packaging technologies enables advanced substrate solutions for future applications.
Built for Precision, Reliability and Long-Term Partnership
Since 2009, HOREXS has focused on advanced IC substrate and ultra-thin PCB manufacturing. With integrated production, engineering support and continuous R&D investment, we provide reliable solutions for BGA, FCCSP, SiP, MEMS, CMOS sensor, RF module and other semiconductor packaging applications.
Explore Our Products
Memory Substrates
Substrate solutions for BGA, eMMC, UFS, DDR, LPDDR, MicroSD and other memory packaging applications.
FCCSP Substrates
High-density package substrates designed for compact semiconductor devices and advanced chip-scale packaging applications.
SiP Package Substrates
Customized substrate solutions for system-in-package applications integrating multiple chips and functional components.
MEMS & Sensor Substrates
Reliable substrate solutions for MEMS, CMOS sensors, fingerprint modules and other sensing applications.