Product Overview
UDP/USB memory substrate manufacture supporting is listed by the original manufacturer in the Memory Substrate range. Published specifications include type of IC Substrate, dielectric layer of TR-4, material of BT/FR4. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Type: IC Substrate
- Dielectric Layer: TR-4
- Material: BT/FR4
- Flame Retardant Properties: V2
- Mechanical Rigid: Rigid
Technical Specifications
| Type | IC Substrate |
|---|---|
| Dielectric Layer | TR-4 |
| Material | BT/FR4 |
| Flame Retardant Properties | V2 |
| Mechanical Rigid | Rigid |
| Processing Technic | Electrolytic Foil |
| Transport Package | Carton |
| Highlight | 0.15mm Multilayer Flexible Pcb , Immersion Gold Multilayer Flexible Pcb , 0.15mm Multilayer Pcb |
Typical Applications
No separate application list was stated on the original product page.
Customization and Supply
Customization requirements should be confirmed from the customer’s drawings and requested configuration.
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
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