HOREXS semiconductor ic package substrate With Chip Wire Bonding

Product Overview

HOREXS semiconductor ic package substrate With Chip Wire Bonding is listed by the original manufacturer in the IC Package Substrate range. Published specifications include base material of BT, application of Telecommunication, solder mask color of Green/black/white/red/blue/yellow. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.

Key Features

• Base Material: BT
• Application: Telecommunication
• Solder Mask Color: Green/black/white/red/blue/yellow
• Type: Ic Package Substrate
• Highlight: Horexs Bga Circuit Board , Ultra Thin Bga Circuit Board , Bga Circuit Board With Wire Bonding

Technical Specifications

Typical Applications

• Telecommunication

Customization and Supply

Customization requirements should be confirmed from the customer’s drawings and requested configuration.

For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.