Product Overview
BGA IC Package Substrate With Cap Plated MGC BT material is listed by the original manufacturer in the IC Package Substrate range. Published specifications include application of Semiconductor Package, type of Ic Substrate, material of BT Material. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Application: Semiconductor Package
- Type: Ic Substrate
- Material: BT Material
- Color: Black
- Feature: High Temperature Resistance,high Strength
Technical Specifications
| Application | Semiconductor Package |
|---|---|
| Type | Ic Substrate |
| Material | BT Material |
| Color | Black |
| Feature | High Temperature Resistance,high Strength |
| Pitch | 90um |
| Highlight | BGA IC Package Substrate , IC Package Substrate With Cap Plated , Horexs Printed Circuit Board |
Typical Applications
- Semiconductor Package
Customization and Supply
Customization requirements should be confirmed from the customer’s drawings and requested configuration.
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
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