Product Overview
4L build up types 0.8mm Gold Surface IC Package Substrate is listed by the original manufacturer in the IC Package Substrate range. Published specifications include layers of 4L, material of FR4, sr of Taiyo. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Layers: 4L
- Material: FR4
- SR: Taiyo
- Color: Black
- Thickness: 0.8mm
Technical Specifications
| Layers | 4L |
|---|---|
| Material | FR4 |
| SR | Taiyo |
| Color | Black |
| Thickness | 0.8mm |
| Highlight | Horexs IC Package Substrate 0.8mm , Gold Surface Multilayer Pcb Board , 0.8mm IC Package Substrate |
Typical Applications
No separate application list was stated on the original product page.
Customization and Supply
Customization requirements should be confirmed from the customer’s drawings and requested configuration.
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
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