Product Overview
Memory Card Ultra Thin FR4 Multi Layer Pcb For Encapsulation is listed by the original manufacturer in the IC Package Substrate range. Published specifications include layers of 2L, material of BT, sr of Taiyo. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Layers: 2L
- Material: BT
- SR: Taiyo
- Color: Customize
- Thickness: 0.2mm
Technical Specifications
| Layers | 2L |
|---|---|
| Material | BT |
| SR | Taiyo |
| Color | Customize |
| Thickness | 0.2mm |
| Line Width | 35um |
| Line Space | 50um |
| Highlight | Horexs FR4 Pcb , Ultra Thin FR4 Pcb For Encapsulation , Memory Card Ultra Thin FR4 Pcb |
Typical Applications
No separate application list was stated on the original product page.
Customization and Supply
- Color: Customize
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
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