0.2mm 2 layer Memory Card substrate Fabrication For Capsulation

0.2mm 2 layer Memory Card substrate Fabrication For Capsulation is listed by the original manufacturer in the IC Package Substrate range. Published specifications include layers of 2L, material of SYTech BT, sr of Taiyo. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.

SKU: HOREXS-13370960 Category: Tags: , ,

Product Overview

0.2mm 2 layer Memory Card substrate Fabrication For Capsulation is listed by the original manufacturer in the IC Package Substrate range. Published specifications include layers of 2L, material of SYTech BT, sr of Taiyo. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.

Key Features

  • Layers: 2L
  • Material: SYTech BT
  • SR: Taiyo
  • Color: Customize
  • Thickness: 0.2mm

Technical Specifications

Layers 2L
Material SYTech BT
SR Taiyo
Color Customize
Thickness 0.2mm
Line Width 35um
Line Space 50um
Highlight 0.2mm Pcb Board Fabrication , Pcb Board Fabrication For Capsulation , 2 Layer Memory Card Pcb

Typical Applications

No separate application list was stated on the original product page.

Customization and Supply

  • Color: Customize

For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.

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