Product Overview
0.2mm Ultrathin MEMS packaging substrate fabrication for microphoneµelectronics is listed by the original manufacturer in the MEMS Substrate range. Published specifications include layers of 2L, material of BT, sr of Taiyo. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Layers: 2L
- Material: BT
- SR: Taiyo
- Color: Black
- Thickness: 0.2mm
Technical Specifications
| Layers | 2L |
|---|---|
| Material | BT |
| SR | Taiyo |
| Color | Black |
| Thickness | 0.2mm |
| Line Width | 50um |
| Line Space | 40um |
| Pitch | 60um |
| Highlight | 0.2mm MEMS PCB , 0.2mm 2 Layer Circuit Board , Ultrathin MEMS PCB For Microphone |
Typical Applications
No separate application list was stated on the original product page.
Customization and Supply
Customization requirements should be confirmed from the customer’s drawings and requested configuration.
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
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