OEM ODM semiconductor packaging substrate China mainland

OEM ODM semiconductor packaging substrate China mainland is listed by the original manufacturer in the BGA Substrate range. Published specifications include layers of 2L, material of BT, sr of Taiyo. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.

SKU: HOREXS-13374434 Category: Tags: , ,

Product Overview

OEM ODM semiconductor packaging substrate China mainland is listed by the original manufacturer in the BGA Substrate range. Published specifications include layers of 2L, material of BT, sr of Taiyo. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.

Key Features

  • Layers: 2L
  • Material: BT
  • SR: Taiyo
  • Color: Black
  • Thickness: 0.3mm

Technical Specifications

Layers 2L
Material BT
SR Taiyo
Color Black
Thickness 0.3mm
Line Width 50um
Line Space 40um
Pitch 60um
Highlight ODM Ultrathin LED PCB Board , OEM 0.2mm LED PCB Board , 0.2mm PCB Board For Keyboard

Typical Applications

No separate application list was stated on the original product page.

Customization and Supply

  • Highlight: ODM Ultrathin LED PCB Board , OEM 0.2mm LED PCB Board , 0.2mm PCB Board For Keyboard

For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.

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