Product Overview
NAND/FLASH Memory Ic packaging Substrate is listed by the original manufacturer in the IC Package Substrate range. Published specifications include material of BT, package type of BGA Package, technology of Tenting. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Material: BT
- Package Type: BGA Package
- Technology: Tenting
- Surface Finished: ENIG(Soft Gold&Hard Gold)/ENEPIG
- Line Width/space: 35/35um
Technical Specifications
| Material | BT |
|---|---|
| Package Type | BGA Package |
| Technology | Tenting |
| Surface Finished | ENIG(Soft Gold&Hard Gold)/ENEPIG |
| Line Width/space | 35/35um |
| Layers | 4 Layer |
| Highlight | FR4 Flash Memory Ic Substrate , 1mil Flash Memory Ic Substrate , Multiple Wafers Nand CSP Substrate |
Typical Applications
No separate application list was stated on the original product page.
Customization and Supply
Customization requirements should be confirmed from the customer’s drawings and requested configuration.
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
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