Product Overview
Customizable coreless IC Package Substrate with 0.09mm Thickness is listed by the original manufacturer in the IC Package Substrate range. Published specifications include application of Industrial Ceramic, material of Alumina Ceramic, size of Size Customized. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Application: Industrial Ceramic
- Material: Alumina Ceramic
- Size: Size Customized
- Shape: Square
- Density: 3.65g/cm3
Technical Specifications
| Application | Industrial Ceramic |
|---|---|
| Material | Alumina Ceramic |
| Size | Size Customized |
| Shape | Square |
| Density | 3.65g/cm3 |
| Warranty | 1 Year |
| Highlight | Hitachi BT IC Package Substrate , IC Package Substrate Size Customized , Square BT IC Package Substrate |
Typical Applications
- Industrial Ceramic
- Of
Customization and Supply
- Size: Size Customized
- Highlight: Hitachi BT IC Package Substrate , IC Package Substrate Size Customized , Square BT IC Package Substrate
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
Reviews
There are no reviews yet.