Product Overview
FCBGA/BGA package substrate manufacture is listed by the original manufacturer in the IC Package Substrate range. Published specifications include name of Semiconductor Substrate, technology of Tenting, package type of BGA Package. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Name: Semiconductor Substrate
- Technology: Tenting
- Package Type: BGA Package
- Line Spec.: 25/25um
- Layers: 4layer
Technical Specifications
| Name | Semiconductor Substrate |
|---|---|
| Technology | Tenting |
| Package Type | BGA Package |
| Line Spec. | 25/25um |
| Layers | 4layer |
| Surface Finished | ENIG(Soft Gold&Hard Gold)/ENEPIG |
Typical Applications
No separate application list was stated on the original product page.
Customization and Supply
Customization requirements should be confirmed from the customer’s drawings and requested configuration.
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
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