Production Line
Advanced IC Substrate Manufacturing Process
HOREXS operates advanced manufacturing facilities specializing in IC substrates and high-density PCB technologies. Our production capabilities cover the complete manufacturing process, including drilling, plating, patterning, exposure, etching, AOI inspection, solder mask, surface finishing, electrical testing, final inspection, and packaging. With intelligent manufacturing systems including MES and ERP, we achieve full process traceability, stable production quality, and efficient delivery management.
OEM / ODM Capability
HOREXS provides comprehensive OEM and ODM services for advanced IC substrate and PCB applications. With strong manufacturing capabilities and experienced R&D support, we help customers transform product concepts into reliable mass-production solutions. From initial design review to prototype development and volume production, our engineering team works closely with customers to optimize performance, reliability, and manufacturability.
Our OEM/ODM capabilities include:
• Wire Bonding Substrate
• BGA Package Substrate
• Embedded Memory IC Substrate
• MEMS / CMOS Sensor Substrate
• RF and Wireless Module Substrate
• Flip Chip CSP Substrate
• SiP Package Substrate
• Advanced IC Package Substrate
Layer Structure Support:
• 2L / 4L / 6L substrate structures
• Build-up technology
• Blind and buried via technology
• High-density interconnect solutions
Contact our engineering team with your Gerber files and technical specifications for professional evaluation.
R&D Innovation
HOREXS continuously invests in semiconductor packaging substrate technologies to support the next generation of electronic applications. Our R&D strategy focuses on miniaturization, high-density integration, and advanced substrate solutions for semiconductor packaging. Through continuous process optimization and technology development, we provide customers with reliable solutions for high-performance applications.
Our R&D focuses on:
1. MEMS / CMOS Sensor Substrates
2. MiniLED and Micro LED Applications
3. Advanced Fine Line Technology:
Line width/space:
35/35μm → 20/20μm → 10/10μm
4. Memory Package Substrate:
BGA / FCCSP Applications
5. SiP / CSP / Advanced Package Substrate Solutions
Material Capability:
Support BT and ABF substrate materials for advanced package applications.
