Product Overview
wirebonding packaging memory substrate with soft gold plating is listed by the original manufacturer in the Memory Substrate range. Published specifications include types of Ic Substrate, thickness of 0.22mm, material of BT. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Types: Ic Substrate
- Thickness: 0.22mm
- Material: BT
- Layer: 2
- Highlight: FR4 SD Card PCB , BT SD Card PCB , FR4 Circuit Board Fabrication
Technical Specifications
| Types | Ic Substrate |
|---|---|
| Thickness | 0.22mm |
| Material | BT |
| Layer | 2 |
| Highlight | FR4 SD Card PCB , BT SD Card PCB , FR4 Circuit Board Fabrication |
Typical Applications
No separate application list was stated on the original product page.
Customization and Supply
Customization requirements should be confirmed from the customer’s drawings and requested configuration.
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
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