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HOREXS ICS
  • Home
  • Products
    • BGA Substrate
    • FCCSP Package Substrate
    • IC Package Substrate
    • IoT Substrate
    • Medical Equipment PCB
    • Memory Substrate
    • MEMS Substrate
    • RF Module Substrate
    • Ultrathin Rigid PCB
    • Sensors Substrate
    • Sip Package Substrate
    • Other Ultrathin Substrate
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HOREXS ICS

No. 28 Yinxian Road
Nancheng Subdistrict
Dongguan, Guangdong, China

[email protected]

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