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2-4layer

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FCCSP Flipchip package substrate manufacture
- IC Package Substrate
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High-Performance SiP Package Substrate for IoT Electronics
- IC Package Substrate
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memory IC substrate manufacture for DDR/LPDDR
- IC Package Substrate
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MEMS package substrate manufacture
- IC Package Substrate
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BGA Substrate25 products
FCCSP Package Substrate7 products
IC Package Substrate46 products
IoT Substrate3 products
Medical Equipment PCB1 product
Memory Substrate19 products
MEMS Substrate3 products
Other Ultrathin Substrate8 products
RF Module Substrate2 products
Sensors Substrate3 products
Sip Package Substrate2 products
Ultrathin Rigid PCB13 products

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BGA Substrate
IC Package Substrate
FCCSP Package Substrate
SiP Package Substrate
Memory Substrate

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HOREXS ICS

No. 28 Yinxian Road
Nancheng Subdistrict
Dongguan, Guangdong, China

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