Product Overview
BGA type packaging memory substrate manufacture is listed by the original manufacturer in the Memory Substrate range. Published specifications include layers of 4L, material of BT, sr of Taiyo AUS308. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Layers: 4L
- Material: BT
- SR: Taiyo AUS308
- Color: Black
- Thickness: 0.21mm
Technical Specifications
| Layers | 4L |
|---|---|
| Material | BT |
| SR | Taiyo AUS308 |
| Color | Black |
| Thickness | 0.21mm |
| Package Type | BGA Package |
| Core Brand | Hitachi |
| Highlight | BGA Ultrathin Rigid PCB , Ultrathin Rigid PCB For RAM Component , Plating Gold Ultrathin Rigid PCB |
Typical Applications
No separate application list was stated on the original product page.
Customization and Supply
Customization requirements should be confirmed from the customer’s drawings and requested configuration.
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
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