Product Overview
ENIG Wire/die Bond BGA package Substrate IC Packaging Substrate fabrication is listed by the original manufacturer in the BGA Substrate range. Published specifications include material of BT, technology of Tenting, package type of BGA Package. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Material: BT
- Technology: Tenting
- Package Type: BGA Package
- Line Spec.: 35/35um
- Layers: 4 Layer
Technical Specifications
| Material | BT |
|---|---|
| Technology | Tenting |
| Package Type | BGA Package |
| Line Spec. | 35/35um |
| Layers | 4 Layer |
| Surface Finished | ENEPIG/ENIG |
| Highlight | Wire Bond BGA Substrate , ENIG BGA Substrate , IC Packaging Substrate Board |
Typical Applications
No separate application list was stated on the original product page.
Customization and Supply
Customization requirements should be confirmed from the customer’s drawings and requested configuration.
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
Reviews
There are no reviews yet.