0.2mm Thickness semiconductor assembly substrate microelectronics packaging substrate

Product Overview

0.2mm Thickness semiconductor assembly substrate microelectronics packaging substrate is listed by the original manufacturer in the BGA Substrate range. Published specifications include layers of 2L, material of BT, sr of Taiyo. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.

Key Features

• Layers: 2L
• Material: BT
• SR: Taiyo
• Color: Black
• Thickness: 0.2mm

Technical Specifications

Typical Applications

• Keyboard Electronics

Customization and Supply

Customization requirements should be confirmed from the customer’s drawings and requested configuration.

For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.