LED chip ic package substrate manufacture supporting

LED chip ic package substrate manufacture supporting is listed by the original manufacturer in the Other Ultrathin Substrate range. Published specifications include layers of 2L, material of BT, sr of Taiyo. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.

SKU: HOREXS-13373266 Category: Tags: , ,

Product Overview

LED chip ic package substrate manufacture supporting is listed by the original manufacturer in the Other Ultrathin Substrate range. Published specifications include layers of 2L, material of BT, sr of Taiyo. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.

Key Features

  • Layers: 2L
  • Material: BT
  • SR: Taiyo
  • Color: Black
  • Thickness: 0.2mm

Technical Specifications

Layers 2L
Material BT
SR Taiyo
Color Black
Thickness 0.2mm
Line Width 50um
Line Space 40um
Pitch 60um
Highlight 60um Pitch LED PCB Board , 60um Pitch Mini LED PCB , Pattern LED PCB Board With SR Plug

Typical Applications

No separate application list was stated on the original product page.

Customization and Supply

Customization requirements should be confirmed from the customer’s drawings and requested configuration.

For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.

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