Product Overview
microelectronics package substrate manufacture is listed by the original manufacturer in the BGA Substrate range. Published specifications include layers of 4L, material of BT, sr of Taiyo. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Layers: 4L
- Material: BT
- SR: Taiyo
- Color: Black
- Thickness: 0.2mm
Technical Specifications
| Layers | 4L |
|---|---|
| Material | BT |
| SR | Taiyo |
| Color | Black |
| Thickness | 0.2mm |
| Line Width | 50um |
| Line Space | 40um |
| Pitch | 60um |
| Highlight | Black Soldermask LED PCB Board , Black Soldermask led lamp pcb , LED PCB Board With total Pad |
Typical Applications
No separate application list was stated on the original product page.
Customization and Supply
Customization requirements should be confirmed from the customer’s drawings and requested configuration.
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
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