Product Overview
BGA/QFN package substrate production for IoT industry semiconductor is listed by the original manufacturer in the IoT Substrate range. Published specifications include type of IC Substrate, material of BT, surface finish of Gold Plating. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Type: IC Substrate
- Material: BT
- Surface Finish: Gold Plating
- Thickness: 0.18mm
- Highlight: 4 Layer Camera Module PCB , Horexs Camera Module PCB , Horexs 4 Layer PCB
Technical Specifications
| Type | IC Substrate |
|---|---|
| Material | BT |
| Surface Finish | Gold Plating |
| Thickness | 0.18mm |
| Highlight | 4 Layer Camera Module PCB , Horexs Camera Module PCB , Horexs 4 Layer PCB |
Typical Applications
No separate application list was stated on the original product page.
Customization and Supply
Customization requirements should be confirmed from the customer’s drawings and requested configuration.
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
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