Product Overview
ENEPIG plating ic package substrate manufacture is listed by the original manufacturer in the IC Package Substrate range. Published specifications include material of BT, package type of BGA Package, surface finished of ENIG/ENEPIG. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Material: BT
- Package Type: BGA Package
- Surface Finished: ENIG/ENEPIG
- Technology: Tenting
- Line Width/space: 25/25um
Technical Specifications
| Material | BT |
|---|---|
| Package Type | BGA Package |
| Surface Finished | ENIG/ENEPIG |
| Technology | Tenting |
| Line Width/space | 25/25um |
| Layers | 4layer |
| Highlight | BT FR4 HDI Substrate , MSAP HDI Substrate , ENIG FlipChip Substrate |
Typical Applications
No separate application list was stated on the original product page.
Customization and Supply
Customization requirements should be confirmed from the customer’s drawings and requested configuration.
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
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