Product Overview
4layer BT material Sip Packaging Substrate Semiconductor package is listed by the original manufacturer in the IC Package Substrate range. Published specifications include material of BT, package type of SIP Package, surface finished of ENIG(Soft Gold&Hard Gold)/ENEPIG. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Material: BT
- Package Type: SIP Package
- Surface Finished: ENIG(Soft Gold&Hard Gold)/ENEPIG
- Line Width/space: 25/25um
- Layer: 4 Layer
Technical Specifications
| Material | BT |
|---|---|
| Package Type | SIP Package |
| Surface Finished | ENIG(Soft Gold&Hard Gold)/ENEPIG |
| Line Width/space | 25/25um |
| Layer | 4 Layer |
| Technology | Tenting |
| Highlight | MSAP Sip Packaging Substrate , BT Sip Packaging Substrate , 4layer CSP Semiconductor Substrate |
Typical Applications
No separate application list was stated on the original product page.
Customization and Supply
Customization requirements should be confirmed from the customer’s drawings and requested configuration.
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
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