Product Overview
BT Memory Card BGA package Substrate 6 layer Immersion Gold is listed by the original manufacturer in the IC Package Substrate range. Published specifications include material of BT FR4, technology of Tenting, package type of IC Package Bongding. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Material: BT FR4
- Technology: Tenting
- Package Type: IC Package Bongding
- Line Width /space: 40/40um
- Layers: 6 Layer
Technical Specifications
| Material | BT FR4 |
|---|---|
| Technology | Tenting |
| Package Type | IC Package Bongding |
| Line Width /space | 40/40um |
| Layers | 6 Layer |
| Surface Finished | ENIG(Soft Gold And Hard Gold) |
| Highlight | BT Memory Card BGA Substrate , FR4 Memory Card BGA Substrate , 6layer Memory Card Storage Substrate |
Typical Applications
No separate application list was stated on the original product page.
Customization and Supply
Customization requirements should be confirmed from the customer’s drawings and requested configuration.
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
Reviews
There are no reviews yet.