Product Overview
CSP BGA Semiconductor Packaging Substrate 4 Layer BT ENEPIG Surface Finished is listed by the original manufacturer in the IC Package Substrate range. Published specifications include material of BT FR4, layers of 4 Layers, package type of CSP BGA Package/FlipChip. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Material: BT FR4
- Layers: 4 Layers
- Package Type: CSP BGA Package/FlipChip
- Technology: MSAP
- Line Width/Space: 20/20um
Technical Specifications
| Material | BT FR4 |
|---|---|
| Layers | 4 Layers |
| Package Type | CSP BGA Package/FlipChip |
| Technology | MSAP |
| Line Width/Space | 20/20um |
| Surface Finished | ENIG(Soft Gold&Hard Gold)/ENEPIG |
| Highlight | BGA IC Packaging Substrate , CSP IC Packaging Substrate , 4 Layer BT MSAP Substrate |
Typical Applications
No separate application list was stated on the original product page.
Customization and Supply
Customization requirements should be confirmed from the customer’s drawings and requested configuration.
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
Reviews
There are no reviews yet.