Product Overview
finleLine Space IC Package Substrate for Wearable and Automotive Electronics is listed by the original manufacturer in the IC Package Substrate range. Published specifications include material of BT, technology of Tenting, surface finished of ENIG(Soft Gold&Hard Gold)/ENEPIG. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Material: BT
- Technology: Tenting
- Surface Finished: ENIG(Soft Gold&Hard Gold)/ENEPIG
- Line Spec.: 25/25um
- Package Type: Module Package
Technical Specifications
| Material | BT |
|---|---|
| Technology | Tenting |
| Surface Finished | ENIG(Soft Gold&Hard Gold)/ENEPIG |
| Line Spec. | 25/25um |
| Package Type | Module Package |
| Layers | 4 Layer |
| Highlight | FBGA IC Packaging Substrate , FR4 IC Packaging Substrate , FBGA Semiconductor Substrate |
Typical Applications
No separate application list was stated on the original product page.
Customization and Supply
Customization requirements should be confirmed from the customer’s drawings and requested configuration.
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
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