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Home/Module Package

Module Package

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finleLine Space IC Package Substrate for Wearable and Automotive Electronics
- IC Package Substrate
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BGA Substrate25 products
FCCSP Package Substrate7 products
IC Package Substrate46 products
IoT Substrate3 products
Medical Equipment PCB1 product
Memory Substrate19 products
MEMS Substrate3 products
Other Ultrathin Substrate8 products
RF Module Substrate2 products
Sensors Substrate3 products
Sip Package Substrate2 products
Ultrathin Rigid PCB13 products

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BGA Substrate
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Nancheng Subdistrict
Dongguan, Guangdong, China

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