Product Overview
0.15mm Thickness 2 Layers IC Package Substrate For memory package is listed by the original manufacturer in the IC Package Substrate range. Published specifications include layers of 2L, material of Hitachi, sr of Taiyo. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Layers: 2L
- Material: Hitachi
- SR: Taiyo
- Color: Customize
- Thickness: 0.15mm
Technical Specifications
| Layers | 2L |
|---|---|
| Material | Hitachi |
| SR | Taiyo |
| Color | Customize |
| Thickness | 0.15mm |
| Line Width | 35um |
| Line Space | 50um |
| Highlight | 0.15mm Thickness IC Package Substrate , 2 Layers IC Package Substrate , FR4 Substrate Printed Circuit Board |
Typical Applications
No separate application list was stated on the original product page.
Customization and Supply
- Color: Customize
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
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