Product Overview
High-Performance FCCSP/FCBOC Package Substrate for PC/Server DRAM and SRAM/LPDDR is listed by the original manufacturer in the FCCSP Package Substrate range. Published specifications include material of BT, thickness of 0.3mm, size of 5*5mm. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Material: BT
- Thickness: 0.3mm
- Size: 5*5mm
- Color: Green
- Highlight: Green CSP package substrate , BT CSP package substrate , BT PBGA package substrate
Technical Specifications
| Material | BT |
|---|---|
| Thickness | 0.3mm |
| Size | 5*5mm |
| Color | Green |
| Highlight | Green CSP package substrate , BT CSP package substrate , BT PBGA package substrate |
Typical Applications
No separate application list was stated on the original product page.
Customization and Supply
Customization requirements should be confirmed from the customer’s drawings and requested configuration.
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
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