Product Overview
0.15mm Gold Finger SD card substrate manufacture is listed by the original manufacturer in the Memory Substrate range. Published specifications include type of IC Substrate, dielectric layer of TR-4, material of BT. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Type: IC Substrate
- Dielectric Layer: TR-4
- Material: BT
- Finished: Soft Gold
- Mechanical Rigid: Rigid
Technical Specifications
| Type | IC Substrate |
|---|---|
| Dielectric Layer | TR-4 |
| Material | BT |
| Finished | Soft Gold |
| Mechanical Rigid | Rigid |
| Highlight | Gold Finger Ultrathin Rigid PCB , 0.15mm Ultrathin Rigid PCB , Smooth Surface Gold Finger PCB |
Typical Applications
No separate application list was stated on the original product page.
Customization and Supply
Customization requirements should be confirmed from the customer’s drawings and requested configuration.
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
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