NAND memory substrate ultrathin FR4 core BT raw material

NAND memory substrate ultrathin FR4 core BT raw material is listed by the original manufacturer in the Ultrathin Rigid PCB range. Published specifications include layers of 4L, material of BT, sr of Taiyo AUS308. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.

SKU: HOREXS-13349100 Category: Tags: , ,

Product Overview

NAND memory substrate ultrathin FR4 core BT raw material is listed by the original manufacturer in the Ultrathin Rigid PCB range. Published specifications include layers of 4L, material of BT, sr of Taiyo AUS308. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.

Key Features

  • Layers: 4L
  • Material: BT
  • SR: Taiyo AUS308
  • Color: Black
  • Thickness: 0.22mm

Technical Specifications

Layers 4L
Material BT
SR Taiyo AUS308
Color Black
Thickness 0.22mm
Highlight 0.2mm Immersion Gold Pcb , Horexs Immersion Gold Pcb , Smooth Solder Mask Pcb

Typical Applications

No separate application list was stated on the original product page.

Customization and Supply

Customization requirements should be confirmed from the customer’s drawings and requested configuration.

For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.

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