Product Overview
FMC NAND / Flash Memory Substrate BT / FR4 Material 70um For Memory Cards is listed by the original manufacturer in the Memory Substrate range. Published specifications include type of NAND/Flash Memory Substrate, material of BT/FR4, soldermask of AUS 308 EG23 EG30. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Type: NAND/Flash Memory Substrate
- Material: BT/FR4
- Soldermask: AUS 308 EG23 EG30
- Bond Finger: 70um
- L/S: 40um
Technical Specifications
| Type | NAND/Flash Memory Substrate |
|---|---|
| Material | BT/FR4 |
| Soldermask | AUS 308 EG23 EG30 |
| Bond Finger | 70um |
| L/S | 40um |
| Highlight | Flash memory substrate , NAND Memory Substrate , FR4 Memory Substrate |
Typical Applications
No separate application list was stated on the original product page.
Customization and Supply
Customization requirements should be confirmed from the customer’s drawings and requested configuration.
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
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