Product Overview
Hitachi BT IC Package Substrate 0.29mm 4 Layer 0.5oz Copper Custom is listed by the original manufacturer in the IC Package Substrate range. Published specifications include mini.line space/width of 1mil (25um), finished thickness of 0.29mm, copper of 0.5oz Or Customize. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Mini.Line Space/width: 1mil (25um)
- Finished Thickness: 0.29mm
- Copper: 0.5oz Or Customize
- Layer: 4 Layer (Customize)
- Name: IC Package Substrate
Technical Specifications
| Mini.Line Space/width | 1mil (25um) |
|---|---|
| Finished Thickness | 0.29mm |
| Copper | 0.5oz Or Customize |
| Layer | 4 Layer (Customize) |
| Name | IC Package Substrate |
| Highlight | IC Package Substrate 0.29mm , 4 layer IC Package Substrate , Hitachi BT IC substrate |
Typical Applications
No separate application list was stated on the original product page.
Customization and Supply
- Copper: 0.5oz Or Customize
- Layer: 4 Layer (Customize)
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
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