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4L

Showing 13–14 of 14 results

OEM ODM Gold Bonding IC Package Substrate 4 Layer
- IC Package Substrate
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RF/mmwave module substrate manufacture
- BGA Substrate
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BGA Substrate25 products
FCCSP Package Substrate7 products
IC Package Substrate46 products
IoT Substrate3 products
Medical Equipment PCB1 product
Memory Substrate19 products
MEMS Substrate3 products
Other Ultrathin Substrate8 products
RF Module Substrate2 products
Sensors Substrate3 products
Sip Package Substrate2 products
Ultrathin Rigid PCB13 products

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BGA Substrate
IC Package Substrate
FCCSP Package Substrate
SiP Package Substrate
Memory Substrate

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HOREXS ICS

No. 28 Yinxian Road
Nancheng Subdistrict
Dongguan, Guangdong, China

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