RF/mmwave module substrate manufacture

RF/mmwave module substrate manufacture is listed by the original manufacturer in the BGA Substrate range. Published specifications include layers of 4L, material of BT, sr of Taiyo. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.

SKU: HOREXS-13374437 Category: Tags: , ,

Product Overview

RF/mmwave module substrate manufacture is listed by the original manufacturer in the BGA Substrate range. Published specifications include layers of 4L, material of BT, sr of Taiyo. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.

Key Features

  • Layers: 4L
  • Material: BT
  • SR: Taiyo
  • Color: Black
  • Thickness: 0.2mm

Technical Specifications

Layers 4L
Material BT
SR Taiyo
Color Black
Thickness 0.2mm
Line Width 25um
Line Space 30um
Pitch 60um
Highlight BT Pcb Printed Circuit Board , 2 Layer Pcb Printed Circuit Board , BT Black Pcb Circuit Board

Typical Applications

No separate application list was stated on the original product page.

Customization and Supply

Customization requirements should be confirmed from the customer’s drawings and requested configuration.

For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.

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