Fingerprint sensors packaging substrate manufacture supporting

Fingerprint sensors packaging substrate manufacture supporting is listed by the original manufacturer in the Sensors Substrate range. Published specifications include material of BT, soler mask of Taiyo, color of Mate Black And Green. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.

SKU: HOREXS-13346655 Category: Tags: ,

Product Overview

Fingerprint sensors packaging substrate manufacture supporting is listed by the original manufacturer in the Sensors Substrate range. Published specifications include material of BT, soler mask of Taiyo, color of Mate Black And Green. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.

Key Features

  • Material: BT
  • Soler Mask: Taiyo
  • Color: Mate Black And Green
  • Thickness: 0.2mm
  • Sureface Teartment: Gold Plating

Technical Specifications

Material BT
Soler Mask Taiyo
Color Mate Black And Green
Thickness 0.2mm
Sureface Teartment Gold Plating
Gold Thickness 3-5u"
Highlight 0.2mm Fingerprint Recognition PCB , 0.2mm PCB Multilayer Fabrication , Gold Plating Fingerprint Recognition PCB

Typical Applications

No separate application list was stated on the original product page.

Customization and Supply

Customization requirements should be confirmed from the customer’s drawings and requested configuration.

For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.

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