FR4 core memory ic substrate manufacture

FR4 core memory ic substrate manufacture is listed by the original manufacturer in the Ultrathin Rigid PCB range. Published specifications include type of Memory Substrate, dielectric layer of TR-4, material of FR4. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.

SKU: HOREXS-13181476 Category: Tags: ,

Product Overview

FR4 core memory ic substrate manufacture is listed by the original manufacturer in the Ultrathin Rigid PCB range. Published specifications include type of Memory Substrate, dielectric layer of TR-4, material of FR4. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.

Key Features

  • Type: Memory Substrate
  • Dielectric Layer: TR-4
  • Material: FR4
  • Line/Space: 40um/40um
  • Finished Thk.: 0.24mm

Technical Specifications

Type Memory Substrate
Dielectric Layer TR-4
Material FR4
Line/Space 40um/40um
Finished Thk. 0.24mm
Highlight 0.4mm Electronic Printed Circuit Board , Smooth Solder Resist Printed Circuit Board , 0.4mm Printed Circuit Board

Typical Applications

No separate application list was stated on the original product page.

Customization and Supply

Customization requirements should be confirmed from the customer’s drawings and requested configuration.

For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.

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