Product Overview
Precision 0.15mm IC Packaging Substrate Fabrication 4 Layer Electrolytic Foil Processing is listed by the original manufacturer in the IC Package Substrate range. Published specifications include dielectric layer of TR-4, material of BT, flame retardant properties of V2. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Dielectric Layer: TR-4
- Material: BT
- Flame Retardant Properties: V2
- Mechanical Rigid: Rigid
- Processing Technic: Electrolytic Foil
Technical Specifications
| Dielectric Layer | TR-4 |
|---|---|
| Material | BT |
| Flame Retardant Properties | V2 |
| Mechanical Rigid | Rigid |
| Processing Technic | Electrolytic Foil |
| Transport Package | Carton |
| Highlight | Precision IC Packaging Substrate Fabrication , BT IC Substrate , Electrolytic Foil IC Substrate |
Typical Applications
No separate application list was stated on the original product page.
Customization and Supply
Customization requirements should be confirmed from the customer’s drawings and requested configuration.
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
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