Product Overview
Soft Gold MCP / CSP Package Substrate BT FR4 0.1 – 0.4mm Finished Thickness is listed by the original manufacturer in the IC Package Substrate range. Published specifications include package of CSP/MCP, finished of Soft Gold, core of 40um,39um. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Package: CSP/MCP
- Finished: Soft Gold
- Core: 40um,39um
- L/S: 35/35um(MP)
- Highlight: Soft Gold CSP Package Substrate , apparatus CSP Package Substrate , Soft Gold MCP Package Substrate
Technical Specifications
| Package | CSP/MCP |
|---|---|
| Finished | Soft Gold |
| Core | 40um,39um |
| L/S | 35/35um(MP) |
| Highlight | Soft Gold CSP Package Substrate , apparatus CSP Package Substrate , Soft Gold MCP Package Substrate |
Typical Applications
No separate application list was stated on the original product page.
Customization and Supply
Customization requirements should be confirmed from the customer’s drawings and requested configuration.
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
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