Ultrathin Rigid PCB manufacture for microelectronics assembly

Ultrathin Rigid PCB manufacture for microelectronics assembly is listed by the original manufacturer in the Ultrathin Rigid PCB range. Published specifications include type of Ultrathin Pcb, core of FR4, finished of Soft Gold. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.

SKU: HOREXS-13181769 Category: Tag:

Product Overview

Ultrathin Rigid PCB manufacture for microelectronics assembly is listed by the original manufacturer in the Ultrathin Rigid PCB range. Published specifications include type of Ultrathin Pcb, core of FR4, finished of Soft Gold. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.

Key Features

  • Type: Ultrathin Pcb
  • Core: FR4
  • Finished: Soft Gold
  • Soldermask: Green Taiyo
  • Copper Thickness: 15um

Technical Specifications

Type Ultrathin Pcb
Core FR4
Finished Soft Gold
Soldermask Green Taiyo
Copper Thickness 15um
Highlight 2 Layer Ultrathin Rigid PCB , Gold Plating Ultrathin Rigid PCB , Soldermask 2 Layer PCB

Typical Applications

No separate application list was stated on the original product page.

Customization and Supply

Customization requirements should be confirmed from the customer’s drawings and requested configuration.

For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.

Reviews

There are no reviews yet.

Be the first to review “Ultrathin Rigid PCB manufacture for microelectronics assembly”

Your email address will not be published. Required fields are marked *