Product Overview
0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material is listed by the original manufacturer in the FCCSP Package Substrate range. Published specifications include material of BT, thickness of 0.3mm, size of 5*5mm. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Material: BT
- Thickness: 0.3mm
- Size: 5*5mm
- Color: Green
- Name: FCCSP Package Substrate
Technical Specifications
| Material | BT |
|---|---|
| Thickness | 0.3mm |
| Size | 5*5mm |
| Color | Green |
| Name | FCCSP Package Substrate |
| Layer | 1-6 Layer (Customize) |
| Highlight | ENEPIG FCCSP package substrate , Buildup Types FCCSP package substrate , 0.3mm FCCSP substrate |
Typical Applications
No separate application list was stated on the original product page.
Customization and Supply
- Layer: 1-6 Layer (Customize)
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
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