ENEPIG/ENIG/Soft Gold
Showing all 7 results
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4 Layer buildup types semiconductor Package Substrate production
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BGA Package of Memory Substrate with ENEPIG ENIG Soft Gold Surface
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BT material BGA semiconductor package Substrate production
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BT material semiconductor Pacakge Substrate L/S 35/35um
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ENEPIG ENIG Soft Gold Package Substrate Customize 1-6 Layer BT Substrate
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MCP package Substrate 0.5oz Copper Customize BT Material
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MGC brand BT CSP package Substrate Fabrication