Product Overview
BGA Package of Memory Substrate with ENEPIG ENIG Soft Gold Surface is listed by the original manufacturer in the BGA Substrate range. Published specifications include material of BT, technology of Tenting, package type of BGA Package. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Material: BT
- Technology: Tenting
- Package Type: BGA Package
- Line Spec.: 35/35um
- Layers: 4 Layer
Technical Specifications
| Material | BT |
|---|---|
| Technology | Tenting |
| Package Type | BGA Package |
| Line Spec. | 35/35um |
| Layers | 4 Layer |
| Surface Finished | ENEPIG/ENIG/Soft Gold |
| Highlight | MicroSD BGA Substrate , TF Memory BGA Substrate , ENEPIG BGA Substrate |
Typical Applications
No separate application list was stated on the original product page.
Customization and Supply
Customization requirements should be confirmed from the customer’s drawings and requested configuration.
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
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