Product Overview
BT material BGA semiconductor package Substrate production is listed by the original manufacturer in the BGA Substrate range. Published specifications include line spec. of 35/35um, material of BT, package type of BGA Package. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Line Spec.: 35/35um
- Material: BT
- Package Type: BGA Package
- Layers: 4 Layer
- Technology: Improved Tenting
Technical Specifications
| Line Spec. | 35/35um |
|---|---|
| Material | BT |
| Package Type | BGA Package |
| Layers | 4 Layer |
| Technology | Improved Tenting |
| Surface Finished | ENEPIG/ENIG/Soft Gold |
| Highlight | FR4 Finished BGA Substrate , 1mil BGA Substrate , Customize Soldermask BGA Substrate |
Typical Applications
No separate application list was stated on the original product page.
Customization and Supply
- Highlight: FR4 Finished BGA Substrate , 1mil BGA Substrate , Customize Soldermask BGA Substrate
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
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