big capacity of memory packaging substrate manufacture

big capacity of memory packaging substrate manufacture is listed by the original manufacturer in the Memory Substrate range. Published specifications include layers of 2L, material of BT, sr of Taiyo. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.

SKU: HOREXS-13370956 Category: Tags: , ,

Product Overview

big capacity of memory packaging substrate manufacture is listed by the original manufacturer in the Memory Substrate range. Published specifications include layers of 2L, material of BT, sr of Taiyo. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.

Key Features

  • Layers: 2L
  • Material: BT
  • SR: Taiyo
  • Color: Customize
  • Thickness: 0.1mm

Technical Specifications

Layers 2L
Material BT
SR Taiyo
Color Customize
Thickness 0.1mm
Line Width 35um
Line Space 35um
Highlight SYTech BT SD Card PCB Board , Fast Turn SD Card PCB , 0.1mm SD Card PCB

Typical Applications

No separate application list was stated on the original product page.

Customization and Supply

  • Color: Customize

For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.

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