Product Overview
BT ENEPIG 4 Layer Sip Package Substrate 0.24mm Finished Thickness is listed by the original manufacturer in the BGA Substrate range. Published specifications include material of BT, package type of Sip Package, line spec. of 35/35um. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.
Key Features
- Material: BT
- Package Type: Sip Package
- Line Spec.: 35/35um
- Layers: 4 Layer
- Surface Finished: ENEPIG/ENIG
Technical Specifications
| Material | BT |
|---|---|
| Package Type | Sip Package |
| Line Spec. | 35/35um |
| Layers | 4 Layer |
| Surface Finished | ENEPIG/ENIG |
| Highlight | 4 Layer Sip Package Substrate , BT ENEPIG Sip Package Substrate , 0.29mm Finished Package Chip Substrate |
Typical Applications
No separate application list was stated on the original product page.
Customization and Supply
Customization requirements should be confirmed from the customer’s drawings and requested configuration.
For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.
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