ENIG(Soft Gold&Hard Gold)/ENEPIG
Showing 1–12 of 17 results
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0.26mm BT BGA IC Substrate Board manufacture
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25um BT IC Package Substrate Soft gold plating
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4layer BT material Sip Packaging Substrate Semiconductor package
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CSP BGA Semiconductor Packaging Substrate 4 Layer BT ENEPIG Surface Finished
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FBGA/PBGA/LGA Package Semiconductor Substrate manufacture
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FBGA/PBGA/LGA Package Semiconductor Substrate Manufacture
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FCBGA/BGA package substrate manufacture
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FCBGA/BGA package substrate manufacture
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FCCSP Flipchip package substrate manufacture
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finleLine Space IC Package Substrate for Wearable and Automotive Electronics
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High-Performance SiP Package Substrate for IoT Electronics
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line/space 25um FBGA Package Substrate For Memory ic packaging