CMOS sensors ic package manufacture supporting

CMOS sensors ic package manufacture supporting is listed by the original manufacturer in the Other Ultrathin Substrate range. Published specifications include layers of 2Layer, material of BT, sr of Taiyo. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.

SKU: HOREXS-13373286 Category: Tags: , ,

Product Overview

CMOS sensors ic package manufacture supporting is listed by the original manufacturer in the Other Ultrathin Substrate range. Published specifications include layers of 2Layer, material of BT, sr of Taiyo. This product is presented for professional B2B sourcing and custom electronics programs. The stated dimensions, materials, finishes, package details, and production requirements should be confirmed against the project drawings before an order is placed.

Key Features

  • Layers: 2Layer
  • Material: BT
  • SR: Taiyo
  • Color: Black
  • Thickness: 0.2mm

Technical Specifications

Layers 2Layer
Material BT
SR Taiyo
Color Black
Thickness 0.2mm
Line Width 50um
Line Space 40um
Pitch 60um
Highlight ultrathin rigid pcb 2 layer , Telecommunications 2 layer pcb board , ultrathin rigid 2 layer pcb

Typical Applications

No separate application list was stated on the original product page.

Customization and Supply

Customization requirements should be confirmed from the customer’s drawings and requested configuration.

For quotation and production review, provide the relevant drawings, design files, stack-up information, and requested quantity where applicable.

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